Founded in 2013, Beijing GinKoo MEMS is a domestic high-end equipment and process service provider for precision micro-structure machining of hard and brittle materials and room temperature wafer bonding. Products are for various applications such as semiconductor, LED, MEMS, advanced packaging, optical communication, medical industry, etc. We can do micro-level drilling, cutting, geometry machining, 2.5D micro-structuring and nano-level polishing on hard and brittle materials including glass, quartz, silicon, ceramics and piezoelectric material. Our room temperature bonding technology is suited for glass-glass, glass-silicon, quartz-quartz, sapphire-sapphire and ceramics hermetic encapsulation and WLP.
- Add: Room 1909, TongDianMingJu Building B, No.1 South Street, BaLiQiao, Tongzhou District, Beijing.
- Tel: 010-65479350
- Fax: 010-65479309
- Email: info@ginkoo-mems.com
GINKOOMEMS