WAFER LEVEL PACKAGING（room temperature)

Product introduction

WAFER-LEVEL PACKAGING FOR ULTRA-THIN GLASSES USING HERMETIC ROOM TEMPERATURE WELDING

TECHNOLOGY

键合材料 BONGING MATERIALS

• 玻璃－玻璃；玻璃－硅；石英－石英；蓝宝石－蓝宝石和透明陶瓷
• Glass-glass; glass-Si；quartz-quartz;sapphire-sapphire and  transparent    ceramics
• 大多数玻璃（(Borofloat 33, D263, ENA1, 石英等)和硅
• Most glass types （Borofloat 33, D263, ENA1, fused silica etc.)and Silicon

材料厚度 MATERIALS THICKNEES

• 顶层晶圆材料厚度：50μm－2mm
• Top wafer material thickness 50μm –2mm
• 底层晶圆材料厚度：最大30mm
• Bottom material thickness: Up to 30 mm

材料大小： MATERIALS SIZE

• 直径：100-200mm
• Diameter:100-200mm