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- Glass&quartz wafer
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- 玻璃激光焊接设备
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- Micro milling
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- Tel: 010-65479350
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Micro-hole processing
- Wafer size:4”6”8”12”
- Thickness：300um-2mm
- Product description:
Product introduction
Parameter specification：
Materials：Glass，Slicon,Fused Silica,Sapphire.Alumina ceramics.
Wafer size: 100 - 200 mm。
Thickness： 200 µm - 2mm。
Minimum hole size：30um。
Hole size tolerance：±0.02mm。
Chipping： ≦100μm
Cross-section shape： Straight & Taper
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